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Basic Information | ||
Supported CPU | LGA1700 socket: Support for the 13th and 12th Generation Intel Core, Pentium Gold and Celeron Processors L3 cache varies with the CPU |
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Chipset | Intel B760 Express Chipset | |
Form Factor | Micro ATX Form Factor; 24.4cm x 24.4cm | |
Memory | ||
Number of Memory Slots | 4 x DIMM sockets | |
Channel Supported | DDR5 | |
Maximum Memory | 128GB (32 GB single DIMM capacity) | |
Supported Memory | Support for DDR5 7600(O.C.) / 7400(O.C.) / 7200(O.C.) / 7000(O.C.) / 6800(O.C.) / 6600(O.C.) / 6400(O.C.) / 6200(O.C.) / 6000(O.C.) / 5800(O.C.) / 5600(O.C.) / 5400(O.C.) / 5200(O.C.) / 4800 / 4000 MT/s memory modules Dual channel memory architecture Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode) Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for Extreme Memory Profile (XMP) memory modules |
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Graphics | ||
Graphics | Integrated Graphics Processor-Intel HD Graphics support: 1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz 1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz |
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Expansion Slots | ||
Expansion Slots | PCI 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16 (PCIEX16) 2 x PCI Express x16 slots, supporting PCIe 3.0 and running at x1 (PCIEX1_1, PCIEX1_2) M.2 Socket 1 x M.2 connector (Socket 3, M key, type 22110/2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU) 2 x M.2 connectors (Socket 3, M key, type 22110/2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB, M2M_SB) 4 x SATA 6Gb/s connectors |
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Storage | ||
Supported Storage | 1 x M.2 connector (Socket 3, M key, type 22110/2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU) 2 x M.2 connectors (Socket 3, M key, type 22110/2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB, M2M_SB) 4 x SATA 6Gb/s connectors |
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Network | ||
LAN | Realtek 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps) 1 x RJ-45 port |
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Wireless | Intel Wi-Fi 6E AX211 WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands BLUETOOTH 5.3 Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate |
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Audio | ||
Audio | Realtek Audio CODEC High Definition Audio 2/4/5.1/7.1-channel Support for S/PDIF Out |
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BIOS | ||
BIOS | 1 x 256 Mbit flash Use of licensed AMI UEFI BIOS PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0 |
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Ports & Connectors | ||
HDMI | 1 x HDMI | |
USB Ports | 1 x USB Type-C port, with USB 3.2 Gen 2 support 1 x USB 3.2 Gen 2 Type-A port (red) 4 x USB 3.2 Gen 1 port 4 x USB 2.0/1.1 ports |
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Display Port | 1 x DisplayPort | |
Audio | 1 x front panel audio header 2 x audio jacks |
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RAID | Supports RAID 0, RAID 1, RAID 5 and RAID 10 for SATA storage devices | |
TPM (Trusted Platform Module ) | 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only) | |
Internal I/O Ports | 1 x 24-pin ATX main power connector 1 x 8-pin ATX 12V power connector 1 x 4-pin ATX 12V power connector 1 x CPU fan header 1 x CPU fan/water cooling pump header 3 x system fan headers 1 x system fan/water cooling pump header 3 x M.2 Socket 3 connectors 4 x SATA 6Gb/s connectors 1 x front panel header 1 x USB Type-C® header, with USB 3.2 Gen 2 support 1 x USB 3.2 Gen 1 header 2 x USB 2.0/1.1 headers 1 x reset button 1 x Q-Flash Plus button 1 x reset jumper 1 x Clear CMOS jumper |
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Others | ||
Special feature | 2 x addressable LED strip headers 2 x RGB LED strip headers iTE I/O Controller Chip Support for GIGABYTE Control Center (GCC) Support for Q-Flash Support for Q-Flash Plus |
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Warranty | ||
Warranty | 3 Years Warranty |
The GIGABYTE B760M AORUS ELITE AX DDR5 13th and 12th Gen mATX Motherboard With fast-moving technology changes, GIGABYTE always follows the latest trends and provides customers with advanced features and the latest technologies. GIGABYTE motherboards are equipped with upgraded power solutions, the latest storage standards, and outstanding connectivity to enable optimized performance for gaming. GIGABYTE Motherboards' unparalleled performance is guaranteed by innovative and optimized thermal design to ensure the best CPU, Chipset, and SSD stability and low temperatures under full load applications and gaming performance. The M.2 Thermal Guard prevents throttling and bottlenecks from high-speed M.2 SSDs as it helps to dissipate heat before it becomes an issue. An enlarged M.2 heatsink prevents high-speed, large-capacity PCIe 4.0/3.0 SSDs from throttling due to overheating. High-coverage MOSFETs and integrated molding Heatsinks to improve thermal efficiency with better airflow and heat exchange. 2X Copper PCBs design effectively lowers the component temperature because of their high thermal conductivity and low impedance. Increased surface area, up to 2X larger compared to traditional heatsinks. It improves heat dissipation from the MOSFETs. TMOS is a TRUE single-piece heatsink. Its one-piece design and larger surface drastically improve the cooling performance compared to competitors' multi-piece designs. TMOS features several channels and inlets on the heatsink. This design allows for the air flow to go through, which leads to a great improvement in the heat transfer performance. GIGABYTE Motherboards enable the ultimate connection experience with blazing data transfer speeds through the next-generation network, storage, and Wi-Fi connectivity. Adoption of 2.5G LAN provides up to 2.5 GbE network connectivity with at least 2X faster transfer speeds compared to general 1GbE networking, perfectly designed for gamers with the ultimate online gaming experience. The GIGABYTE B760M AORUS ELITE AX DDR5 13th and 12th Gen mATX Motherboard has a 3-year warranty.
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