Description

Thermaltake TG-30 Thermal Compound

Contains diamond powder for higher heat transfer providing a thermal conductivity of 4.5 W/m-k.

All-In-One Application Kit

Includes tools to clean, prep, and install fresh thermal compound to your hardware.

Easy to Apply

Specially formulated to easily spread over the included honeycomb stencil for consistent compound application, providing a neat and well-covered CPU.

Sustainability and Safety

The TG-30 is a non-electrically conductive compound eliminating risk of short circuit and offers a longer lifespan minimizing dry-out or cracking.